High frequency circuit module

ABSTRACT

A high frequency circuit module for use in an automotive radar or the like, in which RF circuit parts are mounted on both sides of a hard multilayer dielectric substrate, and a transmission line connecting the RF circuit parts provided on both sides is constructed by a via group including a periodical structure or a via having a coaxial structure perpendicular to faces of the multilayer dielectric substrate. As the multilayer dielectric substrate, a hard multilayer substrate using metallic layers as a microstrip line wiring layer, a DC/IF signal line layer, and grounding metal layers for shielding which are disposed on and under the DC/IF signal line is employed. By using the transmission line achieved by a through via having the periodical structure or the through via having the coaxial structure, an electromagnetic wave propagating in parallel between the grounding conductors is confined.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a high frequency circuit module and,more specifically, to a high frequency circuit module in which a highfrequency circuit part such as a monolithic microwave integrated circuit(hereinbelow, called an MMIC) and an antenna are provided on the surfaceand the rear face, respectively, of a multilayer dielectric substrate.More particularly, the invention relates to a high frequency circuitmodule suitable for an automotive radar module using millimeter waves.

2. Description of the Related Arts

As the most effective system of an intelligent transport system (ITS)solving a traffic accident, traffic jam, environmental problems ofexhaust gas, noise, and so one, resource problems due to largeconsumption of oil energy, and the like caused by “vehicles”, amillimeter wave radar has been developed. In order to equip vehicles asmany as possible with millimeter wave radars, realization of anautomotive radar module having improved flexibility of a vehiclemounting layout by reducing the size and thickness of the millimeterwave radar, reliability, and low cost is demanded.

As a high frequency circuit module adapted to the automotive radar, ahigh frequency circuit module in which an antenna and an MMIC areprovided on the surface and rear face, respectively, of a multilayerdielectric substrate having therein metallic layers is known.

For example, as shown in FIG. 10 (conventional technique 1), on thesurface and rear face of a ceramic multilayer substrate 38 in which aplurality of metallic layers 30 to 33 are provided, an antenna 28 and anMMIC 29 are provided, respectively. As high frequency transmission linesbetween the antenna 28 and the MMIC 29, microstrip lines 34 and 35 andelectro-magnetic coupling slots 36 and 37 are used. Techniques usingelectro-magnetic coupling slots of this kind are disclosed in JapaneseUnexamined Patent Application Nos. 9-237867 and 8-250913. In thisexample of mounting, when a slot having the same structure is formedover a slot to make the transmission line length shortest, a microstripline having a length of around λ/2 remains between the slots and worksas a resonator. However, when electromagnetic coupling slots areprovided above and below the microstrip line, a potential differenceoccurs between the upper and lower slot metallic layers. Consequently,an electromagnetic wave which propagates in parallel between the slotmetallic layers is generated. An amount corresponding to the energy ofthe electromagnetic wave becomes a loss, so that it difficult to realizethe transmission line of a low loss. Therefore, by setting the distancebetween the electromagnetic coupling slots to λ/2 or longer,interference between the slots is prevented and a loss in the transferline is minimized. Due to such a structure, the mounting method usingthe electro-magnetic coupling slots needs a mounting area having thedistance of 2λ or longer between the slots, and layout of the upper andlower electronic parts has to be considered so as not to causeinterference with the transfer mode of the slot coupling part.

As shown in FIG. 11A (conventional technique 2), there is a knowntechnique in which connection between a plurality of conductive layers31 and 33 in the multilayer dielectric substrate 38 having the pluralityof conductive layers 30 to 33 and 39 is realized by a via satisfying thecondition of (R·r)/(2·h)≦L≦(5·R·r)/h (where R, r, and L denote sizesshown in FIG. 11C and h denotes the distance between the conductivelayers). When a signal to be transmitted is in a millimeter wave band,the connection between conductive layers in the multilayer substrateformed by the via satisfying the condition can be made by a connectingmethod of a low loss only in the case where there is one grounding layerconnected to the via. However, occurrence of an electromagnetic wavepropagating between a plurality of grounding layers cannot besuppressed. Consequently, the method cannot be used to connect theconductors to realize a low loss in the millimeter wave band.

Further, as a technique which does not use a dielectric multilayersubstrate, as shown in FIG. 12 (conventional technique 3), there is atechnique in which an MMIC 43 and an antenna 44 are provided on thesurface and rear face, respectively, of a metal base plate 42, and acoaxial structure 45 formed in the base plate 42 is used to connectionthe MMIC 43 and antenna 44. In the structure, the RF circuit substrateincluding the MMIC 43 and the antenna are connected to each other viathe coaxial structure, so that a thin, small millimeter wave radar canbe relatively easily produced. In the diagram, reference numerals 46,47, 48, 49, 50 and 51 denote a circuit substrate, an insulatingmaterial, an outer terminal, an insulating material, a bonding wire, anda transmission/reception circuit cover, respectively.

As described above, the conventional techniques have problems withrespect to easiness in manufacture, manufacturing cost, and circuitcharacteristics. Particularly, to use the modules for an automotivemillimeter wave radar, since the millimeter wave radar is a devicemounted outside of a vehicle and use environments of temperature,moisture, vibration, and the like are hostile, generally, an RF circuithas a hermetic structure of interrupting the outside air. Since thetransmission loss in the millimeter wave band is much larger as comparedwith that in a microwave band, the transmission line has to be designedto be as short as possible. Although the line length can be shortened bymounting the RF circuit part on the same face of the substrate as theantenna, it is difficult to mount the RF circuit part and the antenna onthe same face due to the limited size of the RF circuit part and thehermetic structure.

In order to mount the RF circuit part and the antenna of the millimeterwave radar as close as possible, the RF circuit part and the antenna aremounted on both sides of the mounting substrate so as to be overlapped,and an oscillator and an amplifier of the RF circuit parts have to bedisposed so that the transmission line length becomes the shortest.However, as the mounting substrate of the millimeter wave band, a thinsubstrate having a dielectric thickness of 0.2 mm or less is used tosuppress a transmission line radiation loss. Therefore, the base plate42 for assuring the mechanical strength is needed as shown in FIG. 12for the millimeter wave radar. Consequently, the structure whoseassembling and processing cost is high has to be employed.

A both-sided two-layer substrate is generally used to assure thecharacteristics of the millimeter wave transmission line for an RFcircuit. A transmission line for a millimeter signal, a power providingline, and a transmission line for a low frequency signal are formed onthe same face. Since the high/low frequency signal transmission linesand the power providing line cannot cross each other, aerial wiring suchas a bonding wire is required. The higher the frequency of a signal is,the more the signal easily radiates, and it causes a crosstalk inanother line. It makes the millimeter waver radar unstable. In addition,since the flexibility of designing of layout of the RF circuit isregulated in the two-layer substrate, reduction in cost by reducing thesubstrate area of the expensive RF circuit part is limited.

SUMMARY OF THE INVENTION

An object of the invention is therefore to realize a high frequencycircuit module in which high frequency circuit parts such as MMICs formillimeter waves and microwave and a plane antenna are mounted on amultilayer dielectric substrate and a loss of energy of electromagneticwaves is reduced, and which can be realized at low cost and, further, toprovide a small, thin, and light automotive radar module with highdesign flexibility.

To achieve the object, there is provided a high frequency circuit(hereinbelow, called an RF circuit) module, wherein RF circuit parts aremounted on both sides of a multilayer dielectric substrate, andtransmission lines connecting the RF circuit parts on both sides areconstructed by a group of vias having a periodical structure or viashaving a coaxial structure extended in the direction perpendicular tothe face of the multilayer dielectric substrate.

The via group having the periodical structure is constructed so that aplurality of vias are distributed around a center conductor at apredetermined interval. Particularly, the interval is equal to orsmaller than ¼ of wavelength of a signal of the transmission line. Thevia having the coaxial structure is formed by a center conductor and acylindrical conductor surrounding the center conductor and connected toa grounding conductive layer provided in the multilayer dielectricsubstrate.

In a preferred embodiment of the invention, in an RF circuit module ofan automotive radar module using millimeter waves, RF circuit parts onone of the faces of the hard multilayer dielectric substrate are MMICssuch as an oscillator and an RF circuit part on the other face is anantenna. The invention is not limited to an automotive radar module butcan be applied to an RF circuit module using microwaves and millimeterwaves in which RF circuit parts are mounted on both sides of a hardmultilayer dielectric substrate.

According to the invention, a millimeter wave transmission lineextending vertically to a layer with a small transmission loss isprovided in a hard multilayer dielectric substrate, and a metal layerfor a DC/IF signal is shielded by grounding metal layers in thesubstrate. With the configuration, crosstalk to a DC/IF signal of amillimeter wave signal is lessened, the area occupied by the RF circuitscan be reduced by multilayer wiring of the RF circuit, and resistance todistortion and destruction by a mechanical stress moment of themultilayer substrate is improved. Further, the surface of the multilayerdielectric substrate is flat and the assembling work is easily made byone-side reflowing, so that a small, thin, and low-cost RF circuitmodule can be realized. Particularly, the invention is effective torealize an automotive radar module having excellent cost efficiency andresistance to vibration, which is requested to have high performance.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional side view showing a first embodiment of an RFcircuit module according to the invention.

FIGS. 2A and 2B are diagrams for explaining the first embodiment of amillimeter wave transmission line extending vertically to a layer in amultilayer dielectric substrate.

FIG. 3 is a diagram for explaining a second embodiment of the millimeterwave transmission line extending vertically to a layer in a multilayerdielectric substrate.

FIG. 4 is a diagram for explaining a third embodiment of a millimeterwave transmission line extending vertically to a layer in a multilayerdielectric substrate.

FIG. 5 is a perspective view showing an example of an automotive radarmodule according to the invention.

FIG. 6 is a block diagram showing the configuration of atransmission/reception circuit of a millimeter wave radar.

FIG. 7 is a sectional side view of another example of the automotiveradar module according to the invention.

FIG. 8 is a perspective view of another example of the automotive radarmodule according to the invention.

FIG. 9 is a block diagram showing the circuit configuration of the radarmodule of FIG. 8.

FIG. 10 is a cross section of a conventional high frequency package (1).

FIG. 11 is a diagram showing the configuration of a conventional highfrequency package (2).

FIG. 12 is a cross section of a conventional high frequencytransmission/reception module (3).

DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 is a sectional side view showing the configuration of an exampleof an RF circuit module according to the invention. In the embodiment,as will be described hereinlater, the RF circuit module is used for anautomotive radar using a millimeter wave.

In a hard multilayer dielectric substrate 2 of the embodiment, four harddielectric layers 2-1, 2-2, 2-3, and 2-4 are formed, metallic layers 9,10, and 11 are formed on the layers 2-2, 2-3, and 2-4, respectively, anda metallic pattern 17 is formed on the top face of the layer 2-1. By themetallic pattern 17,. hard dielectric layer 2-1, and metallic layer 9, atransmission line such as a microstrip line is formed. The metalliclayer 10 constructs a power providing line and a low frequency signaltransmission line, and the metallic line 11 is used as a groundingmetallic layer. On the surface of the hard dielectric layer 2-1, RFcircuit parts 5-1 and 5-2 such as MMICs are mounted. On the outer face(rear face) of the dielectric layer 2-4, a metallic pattern 1 forforming an antenna as one of the RF circuit parts is formed.

Between the RF circuit parts 5 and the metallic pattern 1, a millimeterwave transmission line 16 extending perpendicular to the face of themultilayer dielectric substrate 2 is formed as a coupling transmissionline. The millimeter wave transmission line 16 takes the form of atransmission line using a through via having a periodical structure or athrough via having a coaxial structure which will be describedhereinlater and transmits a millimeter wave signal between the metallicpattern 1 of the antenna and the RF circuit parts 5. The metallicpattern 1 of the antenna is processed so as to be adapted to the shapeof a millimeter wave transmission via in the rear face of the RF circuitmodule.

On the top face of the multilayer dielectric substrate 2, not only theplurality of MMICs 5-1 and 5-2 but also other RF circuit parts such as amono layer capacitor 13, a chip part 14, and a metallic patternconstructing a microstrip line are mounted. The RF circuit parts arehermetically sealed with a hermetic cap 4, thereby forming an RF circuitmodule. An input/output connector 15 is provided on the outside of thehermetic cap 4 and on the top face of the multilayer dielectricsubstrate 2.

The hermetic cap 4 is made of a metal or an insulator which is metalplated. The hermetic cap 4 and the hard multilayer dielectric substrate2 are air-tightly sealed with an eutectic solder or the like to suppressdeterioration in the temperature and moisture environments of themillimeter wave RF circuit constructed by the millimeter wave MMIC 5 andthe like. Since the higher the electromagnetic wave is, the more iteasily radiates to the air, particularly to avoid crosstalk in themillimeter wave RF circuit, a wave absorber whose electromagnetic waveabsorption amount is 10 dB or more or a projected structure having aprojection cycle of λ/2 is provided on the inner face of the hermeticcap 4.

The millimeter wave MMIC 5 is bare-chip bonded or flip-chip bonded tothe surface of the hard multilayer dielectric substrate 2. In the caseof the bare chip mounting, since the circuit face is in the surfacelayer, wire bonding can be used for a transmission line of an electricsignal.

FIGS. 2A and 2B are diagrams for explaining the configuration of anexample of the millimeter wave transmission line (hereinbelow, alsocalled a vertical transmission line) 16 formed in the directionperpendicular to the face of the multilayer dielectric substrate 2 inFIG. 1. FIGS. 2A and 2B are perspective view and a partial crosssection, respectively, of the vertical transmission line 16. Each layeris shown in a square shape for simplicity but actually has a wide width.In the uppermost layer 17, a metallic pattern 17-1 is formed by thesurface metallic layer and connected to the MMIC (not shown). Amicrostrip transmission line is formed by the metallic pattern 17-1, thegrounding metallic layer 9 as a counter electrode, and the dielectricsubstrate 2-1 provided between the pattern 17-1 and the layer 9.

The metallic layer 10 is a metallic pattern of a DC (direct current)/IF(intermediate frequency) signal line, and the metallic layer 11 is ametallic pattern for shielding the DC/IF signal line. A cylindricalmetallic pattern 18 is used to connect the grounding metal layers 9 and10 to each other. The cylindrical metallic pattern 18 and a centerconductor 19 construct a via having the coaxial structure.

The coaxial structure is formed by sintering the multilayer dielectricsubstrate 2, irradiating the rear face of the metallic layer 11 with alaser beam to form a hole reaching the metallic layer 9 and after that,performing gold plated filling. The via 19 serving as a centralconductor and the land pattern 17 in the surface layer are larger thanthe land patterns of the metallic layers 9 to 11. A land less pattern ofthe metallic layers 9 to 11 is designed to be ¼ of the wavelength orless, and a land less pattern of the metallic layer 10 is designed to bethe outer diameter size in the case where the characteristic impedanceof the coaxial structure is almost equal to that of the transmissionline 17-1 in the surface layer, thereby realizing the via having thecoaxial structure by which a low transmission loss is obtained.

FIGS. 3A, 3B, and 3C are diagrams for explaining the configuration ofanother example of the millimeter wave transmission line 16 extendedvertically to the layers. FIGS. 3A and 3B are a perspective view and across section, respectively, of the vertical transmission line 16. FIG.3B is a plan view of one layer. In the uppermost layer 17, the metallicpattern 17-1 made by the surface metallic layer is formed and connectedto the MMIC (not shown). The functions of the uppermost layer 17,metallic pattern 9 of the grounding metallic layer, and metallicpatterns 10 and 11 in which the DC/IF signal line is formed are the sameas those of the parts designated by the same reference numerals in FIGS.2A and 2B.

Reference numeral 20 denotes a group of vias connecting the groundingmetallic layers 9 and 11. The via group 20 is disposed so that theinterval of neighboring vias is equal to the cycle which is equal to orsmaller than ¼ of the wavelength λ of a transmission signal. Bysurrounding a via 20 c forming the center conductor with the via group20, the via group 20 functions as an electromagnetic wave wall toconfine the electromagnetic wave propagating in parallel between themetallic layers 9 and 10 and between the metallic layers 10 and 11.Therefore, a low transmission loss which is almost equal to that in thevertical transmission line shown in FIGS. 2A and 2B is achieved.Although the case where the vias of the via group 20 are distributed ina square shape has been described in the example of FIGS. 3A, 3B, and3C, the vias can be distributed in a polygon shape having four or moresides such as a quadrangle or in a circular shape as shown in FIGS. 4Aand 4B.

FIG. 5 is a perspective view of the RF circuit module of FIG. 1 with thehermetic cap 4 taken away. On the multilayer dielectric substrate 2, RFcircuit parts such as an MMIC 21 of an oscillator, an MMIC 22 of a poweramplifier, MMICs 23 and 24 of a receiver, input/output connector 15, asealing pattern 25 for airtight sealing, millimeter wave verticaltransmission lines 3-1, 3-2, and 3-3, a mono layer capacitor 27, and achip part 26 are mounted. The RF circuit parts construct atransmission/reception circuit of a millimeter wave radar shown in FIG.6. The millimeter wave vertical transmission lines 3-1, 3-2, and 3-3 areconstructed by the coaxial line 19 in FIG. 2 or the via group 20 in FIG.3 and connected to the antenna (not shown) on the rear face.

FIG. 6 is a block diagram showing the configuration of thetransmission/reception circuit of the millimeter wave radar. In FIG. 6,to facilitate correspondence with the RF circuit parts of FIG. 5, theblocks are designated by the same numbers as those of the MMICs in FIG.5. Reference numeral 22 denotes the MMIC for the power amplifier, 23 and24 denote the MMICs for receiver, and 3-1, 3-2, and 3-3 are themillimeter wave vertical transmission lines. A millimeter wave signalgenerated by the oscillator 21 is distributed to the power amplifier 22and receivers 23 and 24. The signal amplified by the power amplifier 22is output to the millimeter wave vertical transmission line 3-1 so as tobe transmitted to the transmission antenna. The millimeter wavereception signal subjected to Doppler shift by the vertical transmissionlines 3-2 and 3-3 are applied to the receivers 23 and 24. In each of thereceivers 23 and 24, the received millimeter wave signal and a signal asa local signal from the oscillator 21 are mixed with each other toobtain an intermediate frequency signal.

Referring again to FIG. 5, the MMICs 21 to 24 are mounted by bare chipbonding, flip chip bonding, or reflow with a liver. Since the multilayerdielectric substrate 2 is one-sided substrate, a connector, a mono layercapacitor, and a chip part can be mounted by an automatic mounter andsubjected to a reflow process in a lump. To carry out the operations, itis important that the multilayer dielectric substrate 2 has a flat faceirrespective of the small outer shape. In the case of die-bonding theMMIC, although it is after forming bonding wires, the RF circuit partscan operate in the state of FIG. 5. Consequently, a function test can beeasily carried out. If there is a failure part, it can be easilyreplaced by performing reflow again. After conducting the function testof the RF circuit parts, the hermetic cap is attached and the hermeticprocess is performed, thereby finishing the assembly of the millimeterwave circuit parts. Therefore, the price can be largely reduced also inthe millimeter wave radar module like the method of mounting a siliconsemiconductor module. The sealing pattern 25 is metal plated so as to beeasily bonded to the hermetic cap 4 by eutectic solder, silver paste, orthe like. By surrounding the millimeter wave RF circuits with the cap 4and the grounding metallic layer 25, the structure does not leak themillimeter wave signals to the outside except for the millimeter wavevertical transmission line 3.

In the RF circuit module, by providing five metallic layers in the hardmultilayer dielectric substrate 2, the metallic pattern 17-1 on the topface of the dielectric substrate 2-1, the metallic layer 10 for a DC/IFsignal as an internal layer, the grounding metallic layers 9 and 11 toshield the DC/IF signal on and under the layer 10, and the metallicpattern 1 for the antenna on the rear face can be formed at once, sothat the cost of parts and assembling cost of RF circuit module can bereduced. By employing the multilayer structure, resistance to amechanical stress moment can be improved. In the case where thedielectric of one layer in the multilayer substrate 2 is unignorablythick as compared with the wavelength, if a high frequency signal istransmitted vertically in the multilayer substrate, due to differentpotentials of the metallic layers in the multilayer substrate, each timethe signal passes through the metallic layers, an electromagnetic wavewhich propagates parallel to the face of the metallic layer isgenerated. In the embodiment, however, by the vertical transmission line16, the electromagnetic wave wall 18 having the coaxial structure or theperiodical structure which suppresses the electromagnetic wave in thetransverse direction can be formed.

According to the embodiment, the intermediate frequency signal and thepower to be supplied to each of the MMICs are supplied from the outsidevia the input/output terminal pattern. All of the low frequency signalsare transferred via the metallic layer 10 shielded by the groundingmetallic layers 9 and 11 and are spatially shielded from the RF circuitparts. Thus, the millimeter wave signal transferred via the metalliclayer 10 are not mixed as crosstalk.

By separately providing the transmission line for RF circuits and thesignal lines for IF signals and power in each of the layers of themultilayer substrate, the transmission lines are not crossed each other,so that bonding wires for performing cubic line arrangement can bereduced. Thus, the millimeter wave transmission line can be linearlyformed without being unnecessarily routed, and the area occupied by theRF circuits can be reduced. Consequently, reduction in the cost bydesigning the whole size of the multilayer dielectric substrate to besmaller and increase in the substrate life because of improvement inresistance to destruction by the mechanical stress moment are achieved.

All signals to be transmitted/received to/from the outside are connectedvia the metallic layer 10 and the pattern for the input/output terminal.Consequently, there is no electric line crossing the sealing pattern 25.Since the structure of a contact portion of the hermetic cap 4 and themultilayer dielectric substrate is a simple flat face, an increase inthe cost of the cap 4 and the parts of the multilayer substrate can beminimized and the airtight life is also improved.

FIG. 7 is a sectional side view of another example of an automotiveradar module according to the invention.

In the diagram, the configurations of the millimeter wave circuit part5, hard multilayer substrate 2, hermetic cap 4, and millimeter wavetransmission line 6 are substantially the same as those of the exampleof the RF circuit module.

Since the plane shape of the plane antenna 1 is larger than the area ofthe RF circuit module (hard multilayer substrate 2), a support plate 3for assuring the mechanical strength of the antenna is disposed in theperipheral portion of the RF circuit module. Further, in order toefficiently dissipate the heat of the millimeter wave MMIC 5 to the hardmultilayer substrate 2, a thermal via 7 is formed so that the heat isdissipated to the antenna 1 and the support plate 3.

For the antenna 1, a double-sided two-layer substrate havingpermittivity of 5 or less made of teflon or the like is used to suppressa radiation loss of the millimeter wave transmission line. The length ofone of the sides of the hard multilayer dielectric substrate 2 is 5 cmor less, and the thickness of the substrate 2 is 0.5 mm or more so as tobe resistant to a mechanical stress such as torsion or warp. Thethickness of the dielectric of one layer in the multilayer substrate is150 μm or less and a ceramic material such as glass ceramic or aluminaceramic is used. The millimeter wave MMIC 5 is mounted on the surface ofthe hard multilayer dielectric substrate 2, and the antenna 1 is adheredto the rear face of the hard multilayer dielectric substrate 2 so as totransmit/receive the millimeter wave signal to/from the antenna 1 viathe millimeter wave transmission line 16 using the via.

The support plate 3 is attached to the antenna 1, thereby producingeffects of reinforcement of the mechanical strength of the antenna 1 andthe function of a heat dissipator for dissipating heat in the hardmultilayer dielectric substrate. Particularly, when thermal conductivityis important, a metal plate is used. To increase the radiation effect,holes of a honey comb structure are opened to enlarge the surface areaand the weight of the support plate 3 can be also reduced. To reduce thecost, a press member obtained by pressing a steel plate having both thehoney comb structure and an H-letter cross section and having athickness of 1 mm or less can be also used. In the case of fabricatingthe support plate 3 by a hard plastic material or an organic substratesuch as a glass epoxy substrate which is often used as an electronicsubstrate, an electronic circuit can be mounted on the support plate 3and a circuit for processing an IF signal obtained from the hardmultilayer dielectric substrate and a power circuit can be formed.

The automotive radar module of the embodiment has a structure such thatthe RF circuit module 2 is positioned to the antenna 1 and mounted and,after that, the support plate 3 is adhered so as to surround the RFcircuit module. By using the hard multilayer substrate 2, the mechanicalstrength of the RF circuit module is improved. By adding the supportplate 3, the mechanical strength of the antenna 1 is maintained. In theRF circuit module, the millimeter wave high frequency signaltransmission line is disposed on the surface and the power providingline and the low frequency signal transmission line are disposed in theintermediate layers of the grounding layers, thereby reducing crosstalkof the millimeter wave signal and realizing the multilayer wiring.Consequently, the flexibility of the wiring layout design increases, theoccupied area can be reduced, and a smaller and cheaper RF circuitmodule can be fabricated. The millimeter wave signal of the millimeterwave radar is transmitted via the transmission line using a through viahaving the periodical structure or a through via having the coaxialstructure to the rear face of the RF circuit module 2, and the powerproviding line and the low frequency signal transmission line are routedagain to the surface of the RF circuit module 2 via the intermediatelayers of the grounding layers. Thus, the cap 4 used for achieving thehermetic structure does not cross the signal lines, and the sealing canbe safely achieved.

FIG. 8 is a sectional side view of another example of the automotiveradar module according to the invention. In the embodiment, parts of asignal processing circuit (baseband signal processing circuit) otherthan the RF circuit module are additionally mounted on the top face (onthe side opposite to the antenna conductive pattern 1) of the supportplate 3 of the example shown in FIG. 7. The configuration of thebaseband signal processing circuit is a conventionally known one. Asshown in FIG. 9, the module includes: an analog circuit A for processingan IF signal from an RF circuit module 4, an A/D converting circuit Cfor converting an output of the analog circuit A into a digital signal,a digital circuit D for processing an output of the A/D convertingcircuit C and supplying a control signal to the RF circuit, a recordingcircuit R for transmitting/receiving data to/from the digital circuit D,an input/output terminal 15 for controlling the recording circuit R, acircuit 15′ as a data generating unit interposed between theinput/output terminal 15 and the recording circuit R, for generatingdata according to a request of another electronic device on the basis ofinformation of the recording circuit R, and a power circuit V forsupplying power to the parts. In FIG. 8, the same parts corresponding tothe circuit parts of FIG. 9 are designated by the same referencenumerals. Although lines connecting the parts are formed on the top faceof the support plate 3, they are not shown for simplicity of thedrawing.

1. A high frequency circuit module comprising: RF circuit parts mountedon one side of a first dielectric substrate on which other side a firstgrounding conductive layer is provided; an antenna formed by a seconddielectric substrate, metallic pattern mounted on one side of seconddielectric substrate and a second grounding conductive layer provided onthe other side of second dielectric substrate; a third dielectricsubstrate located between the first and second dielectric substrates;first transmission lines connecting said RF circuit parts and theantenna by a group of vias having a periodical structure or vias havinga coaxial structure and second transmission lines for transmitting anintermediate frequency signal of the RF circuit parts and for providingpower to the RF circuit parts, through a third grounding conductivelayer located in the third dielectric substrate, wherein a transitionline is connected with the RF circuit parts and transmittingmillimeter-wave signal, the first dielectric substrate and the firstgrounding conductive layer form a microstrip transmission line, saidgroup of vias have the periodical structure is constructed so that aplurality of vias are distributed around a center conductor at aninterval which is equal to or smaller than ¼ of wavelength of a signalof said transmission line, and end portion of said vias are connectedthe first grounding conductive layer.
 2. A high frequency circuit moduleaccording to claim 1, wherein the first grounding conductive layer hascircular radial gaps being smaller than ¼ of the wavelength of highfrequency signal be transmitted through the first transmission linebetween an inner land connected to said center conductor and said firstgrounding conductive layer.
 3. A high frequency circuit module accordingto claim 1, wherein said first and third dielectric substrates are madeof glass ceramic or alumina ceramic, and said second dielectricsubstrate is made of teflon whose permittivity is lower thanpermittivity of said first and third other dielectric substrates, asurface size of the second dielectric substrates is wider than surfacesizes of said first and third dielectric substrates, and a support platefor assuring the mechanical strength of the antenna is disposed on onesurface of the second dielectric substrate and in a peripheral portionof said first and third other dielectric substrates.
 4. A high frequencycircuit module according to claim 1, wherein said support plate is atleast one of metal plate, a metal plate in which holes are defined toincrease heat dissipating efficiency, a hard organic substrate, a hardorganic substrate in which holes are defined, and a hard organicsubstrate in which holes are defined and that is metal-plated toincrease thermal conductivity.